With a goal of producing high quality metallic nanocrystalline thin films, this research has centered on gaining a fundamental understanding of the kinetic processes occurring during vapor deposition on amorphous substrates. Using the PLD systems that Dr. Leonard designed and built, we have deposited nanocrystalline Au, Al, and Cr films under various conditions and have developed a unified process model to interpret the results.
Figure 1. Microstructure of polycrystalline gold films deposited on amorphous SiO2 substrates for different substrate temperatures and flux kinetic energy (eV). Symbols circle, square and triangle correspond deposition via evaporation, sputtering, and PLD respectively as found in the literature. Crosses indicate the present experiments we have conducted using PLD.
Our model is a unique extension to current models for polycrystalline film formation. We postulate that there are three fundamental parameters common to all physical vapor deposition: 1) Flux kinetic energy, 2) substrate temperature, and 3) deposition rate. This has enabled us to consider the 3 previously disparate techniques (evaporation, PLD, and sputtering) in a unified process map, as shown Figure 1. With this model, it is predicted that nanocrystalline films can only be formed in the limits of low temperature, flux, and high deposition rate.
We selected pure gold as the primary system to study, as gold is non-reactive in most atmospheres, and is particularly difficult to oxidize. Amorphous SiO2 is easily prepared as a substrate using thermal oxidation of standard silicon wafers, resulting in a high purity, very smooth surface without crystalline order that would affect orientation selection in the early stages of film growth. The deposited films are analyzed with X-ray diffraction and SEM to determine texture and grain morphology, which are found to fit well within in the process maps.
Figure 2. Microstructure of polycrystalline gold films deposited on amorphous SiO2 substrates for different substrate temperatures and deposition rate (A/sec). Symbols circle, square and triangle correspond deposition via evaporation, sputtering, and PLD respectively as found in the literature. Crosses indicate the present experiments we have conducted using PLD.
Although much in the field of epitaxial physical vapor deposition is understood today, the details of polycrystalline film formation on amorphous (glass) substrates is less complete. Gaining a fundamental understanding particularly important for future applications such as wide area sputter deposition for photovoltaics, flat panel displays and architectural glass. Going forward, there are several areas that must be explored.